I had a couple of ideas that I was curious as to Helder's opinion on:
1. Putting a multi-folded piece of paper under the pcb to help support the middle. Clamping the ends is a great idea, but it still looks as though there could be sagging between the pcb and the pi still. I thought that maybe wedging a small piece of paper between the 3D printed gamepad cover and the pcb, would help keep it snug up against the pi.
2. Using a very thin grade of solder. Based on what I've read in the guide and watched in the video and then reviewing a few of the problems I've read people having, I am wondering if the solution would/could lie in using a thin(ner) grade of solder. I'm talking the really thin stuff that could fit in the Pi's GPIO holes. Then use the iron to heat the hole, quick insert the solder into it, quickly touch the iron back to it, and then pull iron and solder back. I saw a similar technique somewhere, but can't remember at the moment.
I am hoping to be able to tell for sure by this weekend. I thought I had everything when Wermy's parts arrived on Saturday and then I realized that the metric system sucks and I had the wrong sized speaker.

Other than remembering that a meter and a yard are similar in size, I'm not good with the metric system at all. My mistake and I'm now waiting for the new speaker I ordered to arrive.